Scientist � Wafer Level Packaging for MEMS devices Responsibilities: � Develop wafer level hermetic/vacuum encapsulation technology for MEMS devices. � Design and run experiments for packaging process module development and process integration � Characterize MEMS packaging, reliability testing and failure analysis � ocument packaging results and provide design rules for wafer level MEMS packaging � Train MEMS consortium members on MEMS packaging � Interface with assignees for process integration activities Requirements: � PhD Degree in Mechanical, Electrical or Material Engineering with 4-5 years of industrial experience � Hands-on experience on wafer level MEMS packaging related works, including microfabrication process, wafer bonding with different material etc. � Knowledge in MEMS design, electrical and mechanical modeling � Excellent communication skills and teamwork with strong self-motivation Contact: Eisa Teoh Institute of Microelectronics (IME) 11 Science Park Road Singapore Science Park II Singapore, Singapore 117685 Singapore Phone: 65-67705351 Fax: 65-67731912 Email: personnelime.a-star.edu.sg
