Scientist � 3D Integration The position is looking for a skilled semiconductor packaging die stacking and die attach expert for 3D integration with TSV. Responsibilities: � Advanced packaging process and technology development for 3D Integration � Development of key TSV and backend module and integration processes � Development of Die Stacking and Die Attach process � Identify and introduce processes and new materials for new packaging solution Requirements � PhD degree in Mechanical engineering or Material science with five years� research experience � Experience in semiconductor Through Silicon Via (TSV), BEOL, bonding, assembly module process or integration � Must possess a broad knowledge of flip chip technology with direct experience in DCA, thermo compression bonding, and copper pillar bonding � Experience in project scoping and execution � Self-motivated and proactive team player with ability to work in a multidisciplinary team � Excellent analytical and problem solving skills Contact: Eisa Teoh Institute of Microelectronics (IME) 11 Science Park Road Singapore Science Park II Singapore, Singapore 117685 Singapore Phone: 65-67705351 Fax: 65-67731912 Email: personnelime.a-star.edu.sg
