Scientist - Photonics Packaging Responsibilities: � Design and conduct experiments to develop low cost and high-precision processes for R&D and product development for Photonics Devices (e.g., Fiber alignment, Lens align/attach). � Contribute to specialty laser diode bonding process development, fiber pig-tailing and optical alignment scheme development. � Participate in the development of photonic package from concept to prototype. � Contribute to the development of photonic packaging and assembly capabilities, especially for Silicon Photonics device components. Requirements � PhD with at least 5 years of engineering experience. � At least 3 years of hands-on engineering experience in datacom/telecom/aerospace/military industry directly responsible for development, validation and transfer to manufacturing of laser or microelectronics packaging processes for high reliability products that involve free space micro-optics, fiber coupling, die bond, wire bond, & hermetic seal. � Strong hands-on process development skills including DOE, SPC, 6-sigma, troubleshooting, and failure analysis. � Familiar with functionality of micro-optics and suppliers. � Opto-mechanical design experiences would be a plus. � Understanding of device components and system level requirement is preferred. Contact: Eisa Teoh Institute of Microelectronics (IME) 11 Science Park Road Singapore Science Park II Singapore, Singapore 117685 Singapore Phone: 65-67705351 Fax: 65-67731912 Email: personnelime.a-star.edu.sg
